DC Field | Value | Language |
---|---|---|
dc.contributor.author | Nah, JW | - |
dc.contributor.author | Suh, JO | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.contributor.author | Tu, KN | - |
dc.date.accessioned | 2013-03-17T22:47:32Z | - |
dc.date.available | 2013-03-17T22:47:32Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-03-16 | - |
dc.identifier.citation | 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, no., pp.50 - 53 | - |
dc.identifier.uri | http://hdl.handle.net/10203/142570 | - |
dc.language | ENG | - |
dc.title | Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-33746533073 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 2005 | - |
dc.citation.beginningpage | 50 | - |
dc.citation.endingpage | 53 | - |
dc.citation.publicationname | 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Nah, JW | - |
dc.contributor.nonIdAuthor | Suh, JO | - |
dc.contributor.nonIdAuthor | Tu, KN | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.