Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Application
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jeon, Duk Young | - |
| dc.contributor.author | Chu, KM | - |
| dc.contributor.author | Lee, JS | - |
| dc.contributor.author | Park, HyoHoon | - |
| dc.date.accessioned | 2013-03-17T10:54:37Z | - |
| dc.date.available | 2013-03-17T10:54:37Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2005 | - |
| dc.identifier.citation | 2005 GIST/KAIST/Kyoto/Tohoku university joint symposium, v., no., pp.13 - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/142554 | - |
| dc.language | ENG | - |
| dc.title | Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Application | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 13 | - |
| dc.citation.publicationname | 2005 GIST/KAIST/Kyoto/Tohoku university joint symposium | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Jeon, Duk Young | - |
| dc.contributor.localauthor | Park, HyoHoon | - |
| dc.contributor.nonIdAuthor | Chu, KM | - |
| dc.contributor.nonIdAuthor | Lee, JS | - |
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