DSpace at KOASAS
College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Thermodynamic alloy design of lead-free solders and thermodynamic issues of lead-free soldering in electronic packaging

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 499
  • Download : 0
Export
DC FieldValueLanguage
dc.contributor.authorJeong, SW-
dc.contributor.authorKim, JH-
dc.contributor.authorLee, Hyuck Mo-
dc.date.accessioned2013-03-17T10:45:18Z-
dc.date.available2013-03-17T10:45:18Z-
dc.date.created2012-02-06-
dc.date.issued2003-07-21-
dc.identifier.citation58th Congresso Anual da ABM (Associacao Brasileira de Metalurgia e Materiais), v., no., pp.842 - 849-
dc.identifier.urihttp://hdl.handle.net/10203/142504-
dc.languageENG-
dc.titleThermodynamic alloy design of lead-free solders and thermodynamic issues of lead-free soldering in electronic packaging-
dc.typeConference-
dc.identifier.scopusid2-s2.0-1842578269-
dc.type.rimsCONF-
dc.citation.beginningpage842-
dc.citation.endingpage849-
dc.citation.publicationname58th Congresso Anual da ABM (Associacao Brasileira de Metalurgia e Materiais)-
dc.identifier.conferencecountryBrazil-
dc.identifier.conferencecountryBrazil-
dc.contributor.localauthorLee, Hyuck Mo-
dc.contributor.nonIdAuthorJeong, SW-
dc.contributor.nonIdAuthorKim, JH-
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

Display Simple Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0