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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of electroplating parameters on the defects of copper via for 3D SiP

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dc.contributor.authorCho, BH-
dc.contributor.authorLee, Won-Jong-
dc.contributor.authorLee, JH-
dc.date.accessioned2013-03-17T10:19:33Z-
dc.date.available2013-03-17T10:19:33Z-
dc.date.created2012-02-06-
dc.date.issued2006-09-10-
dc.identifier.citationIUMRS International Conference in Asia 2006, IUMRS-ICA 2006, v.124-126, no.PART 1, pp.49 - 52-
dc.identifier.issn1012-0394-
dc.identifier.urihttp://hdl.handle.net/10203/142354-
dc.languageENG-
dc.titleEffects of electroplating parameters on the defects of copper via for 3D SiP-
dc.typeConference-
dc.identifier.scopusid2-s2.0-38549124047-
dc.type.rimsCONF-
dc.citation.volume124-126-
dc.citation.issuePART 1-
dc.citation.beginningpage49-
dc.citation.endingpage52-
dc.citation.publicationnameIUMRS International Conference in Asia 2006, IUMRS-ICA 2006-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorLee, Won-Jong-
dc.contributor.nonIdAuthorCho, BH-
dc.contributor.nonIdAuthorLee, JH-
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MS-Conference Papers(학술회의논문)
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