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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Adhesion and reliability of Anisotropic Conductive Films (ACFs) joints on Organic Solderability Preservatives (OSPs) metal surface finish

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dc.contributor.authorKim, HJko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2007-09-11T06:23:12Z-
dc.date.available2007-09-11T06:23:12Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2007-05-29-
dc.identifier.citation57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1707 - 1713-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/1417-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleAdhesion and reliability of Anisotropic Conductive Films (ACFs) joints on Organic Solderability Preservatives (OSPs) metal surface finish-
dc.typeConference-
dc.identifier.wosid000247705500258-
dc.identifier.scopusid2-s2.0-35348829059-
dc.type.rimsCONF-
dc.citation.beginningpage1707-
dc.citation.endingpage1713-
dc.citation.publicationname57th Electronic Components and Technology Conference 2007, ECTC '07-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSparks, NV-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorKim, HJ-
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MS-Conference Papers(학술회의논문)
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