Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for the Application of Cu Diffusion Barrier
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | KANG SANG WON | - |
| dc.date.accessioned | 2013-03-17T08:24:03Z | - |
| dc.date.available | 2013-03-17T08:24:03Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2004-08-01 | - |
| dc.identifier.citation | AVS 6th International Conference on Atomic Layer Deposition, v., no., pp.0 - 0 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/141558 | - |
| dc.language | ENG | - |
| dc.title | Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for the Application of Cu Diffusion Barrier | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 0 | - |
| dc.citation.endingpage | 0 | - |
| dc.citation.publicationname | AVS 6th International Conference on Atomic Layer Deposition | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | KANG SANG WON | - |
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