High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | - |
| dc.contributor.author | Ryu, Chunghyun | - |
| dc.contributor.author | Chung, Daehyun | - |
| dc.contributor.author | Lee, Junho | - |
| dc.contributor.author | Lee, Kwangyong | - |
| dc.contributor.author | Oh, Taesung | - |
| dc.date.accessioned | 2013-03-17T07:48:02Z | - |
| dc.date.available | 2013-03-17T07:48:02Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2005-10 | - |
| dc.identifier.citation | IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging, v., no., pp.151 - 154 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/141274 | - |
| dc.language | ENG | - |
| dc.publisher | IEEE | - |
| dc.title | High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 151 | - |
| dc.citation.endingpage | 154 | - |
| dc.citation.publicationname | IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Ryu, Chunghyun | - |
| dc.contributor.nonIdAuthor | Chung, Daehyun | - |
| dc.contributor.nonIdAuthor | Lee, Junho | - |
| dc.contributor.nonIdAuthor | Lee, Kwangyong | - |
| dc.contributor.nonIdAuthor | Oh, Taesung | - |
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