DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, JS | - |
dc.contributor.author | Chu, KM | - |
dc.contributor.author | Park, HyoHoon | - |
dc.contributor.author | Jeon, DukYoung | - |
dc.date.accessioned | 2013-03-17T07:24:06Z | - |
dc.date.available | 2013-03-17T07:24:06Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2004-01-05 | - |
dc.identifier.citation | Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), v., no., pp.117 - 122 | - |
dc.identifier.uri | http://hdl.handle.net/10203/141102 | - |
dc.language | ENG | - |
dc.publisher | AGEC | - |
dc.title | Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-2342538929 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 117 | - |
dc.citation.endingpage | 122 | - |
dc.citation.publicationname | Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC) | - |
dc.identifier.conferencecountry | Hong Kong | - |
dc.identifier.conferencecountry | Hong Kong | - |
dc.contributor.localauthor | Park, HyoHoon | - |
dc.contributor.localauthor | Jeon, DukYoung | - |
dc.contributor.nonIdAuthor | Lee, JS | - |
dc.contributor.nonIdAuthor | Chu, KM | - |
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