DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Kim, Sung Yeol | - |
dc.contributor.author | Baek, Dong-Cheon | - |
dc.date.accessioned | 2013-03-17T07:14:04Z | - |
dc.date.available | 2013-03-17T07:14:04Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005 | - |
dc.identifier.citation | 2005 KSME Spring Conference, 05S014, v., no., pp.9 - 9 | - |
dc.identifier.uri | http://hdl.handle.net/10203/141003 | - |
dc.language | KOR | - |
dc.title | Effect of thickness on mechanical properties and behavior of submicron copper film on polymer substrate | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 9 | - |
dc.citation.endingpage | 9 | - |
dc.citation.publicationname | 2005 KSME Spring Conference, 05S014 | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Kim, Sung Yeol | - |
dc.contributor.nonIdAuthor | Baek, Dong-Cheon | - |
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