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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Flip chip assembly on PCB substrates with coined solder bumps

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dc.contributor.authorNah, JWko
dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorCho, SJko
dc.contributor.authorKim, WHko
dc.date.accessioned2007-09-11T06:00:31Z-
dc.date.available2007-09-11T06:00:31Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2003-05-27-
dc.identifier.citation53rd Electronic Components and Technology Conference, pp.244 - 249-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/1407-
dc.description.sponsorshipThis work was funded by Samsung Electro-Mechanics Co. LTD in Korea. This work was also supported in part by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleFlip chip assembly on PCB substrates with coined solder bumps-
dc.typeConference-
dc.identifier.wosid000183448100037-
dc.identifier.scopusid2-s2.0-0037674970-
dc.type.rimsCONF-
dc.citation.beginningpage244-
dc.citation.endingpage249-
dc.citation.publicationname53rd Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationNew Orleans LA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorNah, JW-
dc.contributor.nonIdAuthorCho, SJ-
dc.contributor.nonIdAuthorKim, WH-
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