DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, SA | - |
dc.contributor.author | Seo, YH | - |
dc.contributor.author | Cho, Young-Ho | - |
dc.contributor.author | Kim, GH | - |
dc.contributor.author | Bu, JU | - |
dc.date.accessioned | 2013-03-17T06:23:54Z | - |
dc.date.available | 2013-03-17T06:23:54Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003-01-19 | - |
dc.identifier.citation | IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems, v., no., pp.614 - 617 | - |
dc.identifier.uri | http://hdl.handle.net/10203/140627 | - |
dc.language | ENG | - |
dc.title | Fabrication and characterization of a low-temperature hermetic MEMS package bonded by a closed loop AuSn solder-line | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-0037817703 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 614 | - |
dc.citation.endingpage | 617 | - |
dc.citation.publicationname | IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems | - |
dc.identifier.conferencecountry | Japan | - |
dc.identifier.conferencecountry | Japan | - |
dc.contributor.localauthor | Cho, Young-Ho | - |
dc.contributor.nonIdAuthor | Kim, SA | - |
dc.contributor.nonIdAuthor | Seo, YH | - |
dc.contributor.nonIdAuthor | Kim, GH | - |
dc.contributor.nonIdAuthor | Bu, JU | - |
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