Fabrication and characterization of a low-temperature hermetic MEMS package bonded by a closed loop AuSn solder-line

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 252
  • Download : 0
Issue Date
2003-01-19
Language
ENG
Citation

IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems, pp.614 - 617

URI
http://hdl.handle.net/10203/140627
Appears in Collection
BiS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0