Fabrication and characterization of a low-temperature hermetic MEMS package bonded by a closed loop AuSn solder-line
- Issue Date
- 2003-01-19
- Language
- ENG
- Citation
IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems, pp.614 - 617
- Appears in Collection
- BiS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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