Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs

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dc.contributor.authorJeon, YDko
dc.contributor.authorOstmann, Ako
dc.contributor.authorReichl, Hko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2007-09-11T05:48:20Z-
dc.date.available2007-09-11T05:48:20Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2003-05-27-
dc.identifier.citation53rd Electronic Components and Technology Conference 2003, pp.1203 - 1208-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/1402-
dc.description.sponsorshipThis work was supported by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleComparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs-
dc.typeConference-
dc.identifier.wosid000183448100197-
dc.identifier.scopusid2-s2.0-0038688838-
dc.type.rimsCONF-
dc.citation.beginningpage1203-
dc.citation.endingpage1208-
dc.citation.publicationname53rd Electronic Components and Technology Conference 2003-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationNew Orleans LA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorJeon, YD-
dc.contributor.nonIdAuthorOstmann, A-
dc.contributor.nonIdAuthorReichl, H-
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