DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jeon, YD | ko |
dc.contributor.author | Ostmann, A | ko |
dc.contributor.author | Reichl, H | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2007-09-11T05:48:20Z | - |
dc.date.available | 2007-09-11T05:48:20Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003-05-27 | - |
dc.identifier.citation | 53rd Electronic Components and Technology Conference 2003, pp.1203 - 1208 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1402 | - |
dc.description.sponsorship | This work was supported by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs | - |
dc.type | Conference | - |
dc.identifier.wosid | 000183448100197 | - |
dc.identifier.scopusid | 2-s2.0-0038688838 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1203 | - |
dc.citation.endingpage | 1208 | - |
dc.citation.publicationname | 53rd Electronic Components and Technology Conference 2003 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | New Orleans LA | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Jeon, YD | - |
dc.contributor.nonIdAuthor | Ostmann, A | - |
dc.contributor.nonIdAuthor | Reichl, H | - |
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