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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Characterization of Young's Modulus of Electroplated Cu Films using Nanoindentation Techniques

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dc.contributor.authorHong, Soon-Hyung-
dc.contributor.authorKim, YM-
dc.contributor.authorKim, KS-
dc.contributor.authorHahn, JH-
dc.contributor.authorLee, CS-
dc.contributor.authorPark, JH-
dc.date.accessioned2013-03-17T05:32:30Z-
dc.date.available2013-03-17T05:32:30Z-
dc.date.created2012-02-06-
dc.date.issued2003-
dc.identifier.citationInternational Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/140260-
dc.languageENG-
dc.titleCharacterization of Young's Modulus of Electroplated Cu Films using Nanoindentation Techniques-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameInternational Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials-
dc.identifier.conferencecountryHong Kong-
dc.identifier.conferencecountryHong Kong-
dc.contributor.localauthorHong, Soon-Hyung-
dc.contributor.nonIdAuthorKim, YM-
dc.contributor.nonIdAuthorKim, KS-
dc.contributor.nonIdAuthorHahn, JH-
dc.contributor.nonIdAuthorLee, CS-
dc.contributor.nonIdAuthorPark, JH-
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MS-Conference Papers(학술회의논문)
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