Via filling for system in packaging by using ionized metal plasma PVD and electroplating
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Won-Jong | - |
| dc.contributor.author | Cho, Byung Hoon | - |
| dc.date.accessioned | 2013-03-17T05:18:25Z | - |
| dc.date.available | 2013-03-17T05:18:25Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2004 | - |
| dc.identifier.citation | Kyoto Joint Symposium on Materials Science and Engineering for the 21st Century, v., no., pp.88 - 88 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/140169 | - |
| dc.language | ENG | - |
| dc.title | Via filling for system in packaging by using ionized metal plasma PVD and electroplating | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 88 | - |
| dc.citation.endingpage | 88 | - |
| dc.citation.publicationname | Kyoto Joint Symposium on Materials Science and Engineering for the 21st Century | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.contributor.localauthor | Lee, Won-Jong | - |
| dc.contributor.nonIdAuthor | Cho, Byung Hoon | - |
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