Chip warpage damage model for ACA/NCA film type electronic packages
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.contributor.author | Yang, Se Young | - |
| dc.contributor.author | Kwon, Woon-Seong | - |
| dc.contributor.author | Paik, Kyoung-Wook | - |
| dc.date.accessioned | 2013-03-17T04:59:54Z | - |
| dc.date.available | 2013-03-17T04:59:54Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2004 | - |
| dc.identifier.citation | APCFS(Asian Pacific Conf for Fracture and Strength)'04, v., no., pp.103 - 103 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/140043 | - |
| dc.language | ENG | - |
| dc.title | Chip warpage damage model for ACA/NCA film type electronic packages | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 103 | - |
| dc.citation.endingpage | 103 | - |
| dc.citation.publicationname | APCFS(Asian Pacific Conf for Fracture and Strength)'04 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Yang, Se Young | - |
| dc.contributor.nonIdAuthor | Kwon, Woon-Seong | - |
| dc.contributor.nonIdAuthor | Paik, Kyoung-Wook | - |
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