DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Yang, Se Young | - |
dc.contributor.author | Kim, Ilho | - |
dc.date.accessioned | 2013-03-17T04:44:44Z | - |
dc.date.available | 2013-03-17T04:44:44Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2004 | - |
dc.identifier.citation | KAIST-Tokyo Tech Joint Workshop, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/139939 | - |
dc.language | ENG | - |
dc.title | Measurement of Thermomechanical Behavior of Solder Joints under Power cycling Condition Using Moire Interferometry | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | KAIST-Tokyo Tech Joint Workshop | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Yang, Se Young | - |
dc.contributor.nonIdAuthor | Kim, Ilho | - |
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