Comparition of Sn-2.8Ag-20In and Sn-10Bi-10In Solders for Intermedate Step Soldering
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Hyuck Mo | - |
| dc.contributor.author | Seo, SK | - |
| dc.contributor.author | Choi, WK | - |
| dc.date.accessioned | 2013-03-17T03:35:47Z | - |
| dc.date.available | 2013-03-17T03:35:47Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2006-03-14 | - |
| dc.identifier.citation | 135th TMS Annual Meeting, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/139456 | - |
| dc.language | ENG | - |
| dc.title | Comparition of Sn-2.8Ag-20In and Sn-10Bi-10In Solders for Intermedate Step Soldering | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 135th TMS Annual Meeting | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Lee, Hyuck Mo | - |
| dc.contributor.nonIdAuthor | Seo, SK | - |
| dc.contributor.nonIdAuthor | Choi, WK | - |
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