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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Fabrication of Microneedle Array using Inclined LIGA and Hot Embossing Process

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dc.contributor.authorMoon, SJ-
dc.contributor.authorLee, Seung Seob-
dc.date.accessioned2013-03-17T02:57:17Z-
dc.date.available2013-03-17T02:57:17Z-
dc.date.created2012-02-06-
dc.date.issued2003-
dc.identifier.citation11th Asia-Pacific Conf. on Non-Destructive Testing (APCNDT2003), v., no., pp.236 --
dc.identifier.urihttp://hdl.handle.net/10203/139153-
dc.languageENG-
dc.titleFabrication of Microneedle Array using Inclined LIGA and Hot Embossing Process-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage236-
dc.citation.publicationname11th Asia-Pacific Conf. on Non-Destructive Testing (APCNDT2003)-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorLee, Seung Seob-
dc.contributor.nonIdAuthorMoon, SJ-
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ME-Conference Papers(학술회의논문)
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