Micromaterials and Process for MEMS Bonding and Packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Cho, Young-Ho | - |
| dc.date.accessioned | 2013-03-17T00:32:57Z | - |
| dc.date.available | 2013-03-17T00:32:57Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2000-06-20 | - |
| dc.identifier.citation | First Korea-Switzerland Joint Symposium on Materials and Interfaces in MEMS Applications, v., no., pp.14 - 17 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/137848 | - |
| dc.language | ENG | - |
| dc.title | Micromaterials and Process for MEMS Bonding and Packaging | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 14 | - |
| dc.citation.endingpage | 17 | - |
| dc.citation.publicationname | First Korea-Switzerland Joint Symposium on Materials and Interfaces in MEMS Applications | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Cho, Young-Ho | - |
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