Development of PMP system for high-speed measurement of solder paste volume on printed circuit boards

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dc.contributor.authorJeong, Kyung Min-
dc.contributor.authorKim, Jae-Seon-
dc.contributor.authorKoh, Kyoungchul-
dc.contributor.authorCho, Hyungsuck-
dc.date.accessioned2007-09-10T03:24:32Z-
dc.date.available2007-09-10T03:24:32Z-
dc.date.created2012-02-06-
dc.date.issued2001-
dc.identifier.citationProceedings of SPIE, v., no., pp.250 - 259-
dc.identifier.issn0277-786X-
dc.identifier.urihttp://hdl.handle.net/10203/1375-
dc.descriptionCopyright (2001) Society of Photo-Optical Instrumentation Engineers.en
dc.languageENG-
dc.language.isoen_USen
dc.publisherInternational Society for Optical Engineering (SPIE)-
dc.titleDevelopment of PMP system for high-speed measurement of solder paste volume on printed circuit boards-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage250-
dc.citation.endingpage259-
dc.citation.publicationnameProceedings of SPIE-
dc.contributor.localauthorCho, Hyungsuck-
dc.contributor.nonIdAuthorJeong, Kyung Min-
dc.contributor.nonIdAuthorKim, Jae-Seon-
dc.contributor.nonIdAuthorKoh, Kyoungchul-

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