Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis

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dc.contributor.authorLee, BW-
dc.contributor.authorJeong, JH-
dc.contributor.authorJang, WS-
dc.contributor.authorKim, JY-
dc.contributor.authorKim, DW-
dc.contributor.authorKwon, DI-
dc.contributor.authorNah, JW-
dc.contributor.authorPaik Kyung-Wook-
dc.date.accessioned2013-03-16T23:57:12Z-
dc.date.available2013-03-16T23:57:12Z-
dc.date.created2012-06-25-
dc.date.issued2002-10-
dc.identifier.citationThe Third International Conference On Advanced Materials Development and Performance, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/137519-
dc.languageENG-
dc.publisherKyungpook National University-
dc.titleDetermination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameThe Third International Conference On Advanced Materials Development and Performance-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorPaik Kyung-Wook-
dc.contributor.nonIdAuthorLee, BW-
dc.contributor.nonIdAuthorJeong, JH-
dc.contributor.nonIdAuthorJang, WS-
dc.contributor.nonIdAuthorKim, JY-
dc.contributor.nonIdAuthorKim, DW-
dc.contributor.nonIdAuthorKwon, DI-
dc.contributor.nonIdAuthorNah, JW-
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MS-Conference Papers(학술회의논문)
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