DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, BW | - |
dc.contributor.author | Jeong, JH | - |
dc.contributor.author | Jang, WS | - |
dc.contributor.author | Kim, JY | - |
dc.contributor.author | Kim, DW | - |
dc.contributor.author | Kwon, DI | - |
dc.contributor.author | Nah, JW | - |
dc.contributor.author | Paik Kyung-Wook | - |
dc.date.accessioned | 2013-03-16T23:57:12Z | - |
dc.date.available | 2013-03-16T23:57:12Z | - |
dc.date.created | 2012-06-25 | - |
dc.date.issued | 2002-10 | - |
dc.identifier.citation | The Third International Conference On Advanced Materials Development and Performance, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/137519 | - |
dc.language | ENG | - |
dc.publisher | Kyungpook National University | - |
dc.title | Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | The Third International Conference On Advanced Materials Development and Performance | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Paik Kyung-Wook | - |
dc.contributor.nonIdAuthor | Lee, BW | - |
dc.contributor.nonIdAuthor | Jeong, JH | - |
dc.contributor.nonIdAuthor | Jang, WS | - |
dc.contributor.nonIdAuthor | Kim, JY | - |
dc.contributor.nonIdAuthor | Kim, DW | - |
dc.contributor.nonIdAuthor | Kwon, DI | - |
dc.contributor.nonIdAuthor | Nah, JW | - |
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