Characterization of Mechanical Properties of Electrodeposited Cu Thin Films by Nanoindentation Technique
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hong, Soon Hyung | - |
| dc.date.accessioned | 2013-03-16T22:45:48Z | - |
| dc.date.available | 2013-03-16T22:45:48Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-10-01 | - |
| dc.identifier.citation | , v., no., pp.8 - 11 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/136851 | - |
| dc.language | KOR | - |
| dc.title | Characterization of Mechanical Properties of Electrodeposited Cu Thin Films by Nanoindentation Technique | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 8 | - |
| dc.citation.endingpage | 11 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Hong, Soon Hyung | - |
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