DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kang, Tae Goo | - |
dc.contributor.author | Cho, Young-Ho | - |
dc.date.accessioned | 2013-03-16T22:42:18Z | - |
dc.date.available | 2013-03-16T22:42:18Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1999-11-14 | - |
dc.identifier.citation | Inter. Mechanical Engineering Congress and Exposition (IMECE '99), v., no., pp.541 - 544 | - |
dc.identifier.uri | http://hdl.handle.net/10203/136810 | - |
dc.language | ENG | - |
dc.title | Near-Field Electromagnetic Shielding Effect of On-Chip Electroplated Copper Layers | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 541 | - |
dc.citation.endingpage | 544 | - |
dc.citation.publicationname | Inter. Mechanical Engineering Congress and Exposition (IMECE '99) | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Cho, Young-Ho | - |
dc.contributor.nonIdAuthor | Kang, Tae Goo | - |
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