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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Application of a 3-D Field Solver for On-chip and Package Microstrip Interconnection Design

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dc.contributor.authorKim, Joungho-
dc.contributor.authorRyu, Woonghwan-
dc.contributor.authorLu, Albert-
dc.contributor.authorWai, Chee-
dc.contributor.authorWei, Fan-
dc.date.accessioned2013-03-16T20:51:09Z-
dc.date.available2013-03-16T20:51:09Z-
dc.date.created2012-02-06-
dc.date.issued2000-
dc.identifier.citationIEEE EPTC 2000, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/135711-
dc.languageENG-
dc.publisherIEEE-
dc.titleApplication of a 3-D Field Solver for On-chip and Package Microstrip Interconnection Design-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameIEEE EPTC 2000-
dc.identifier.conferencecountrySingapore-
dc.identifier.conferencecountrySingapore-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorRyu, Woonghwan-
dc.contributor.nonIdAuthorLu, Albert-
dc.contributor.nonIdAuthorWai, Chee-
dc.contributor.nonIdAuthorWei, Fan-
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EE-Conference Papers(학술회의논문)
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