DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, DoHyun | - |
dc.date.accessioned | 2013-03-16T20:38:32Z | - |
dc.date.available | 2013-03-16T20:38:32Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2000-10 | - |
dc.identifier.citation | Proc. 13th Intern. Symposium on Chemical Engineering, v.0, no., pp.43 - 44 | - |
dc.identifier.uri | http://hdl.handle.net/10203/135588 | - |
dc.language | ENG | - |
dc.title | Numerical Simulation of the Slurry Flow between a wafer and a Pad during CMP Processes | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.volume | 0 | - |
dc.citation.beginningpage | 43 | - |
dc.citation.endingpage | 44 | - |
dc.citation.publicationname | Proc. 13th Intern. Symposium on Chemical Engineering | - |
dc.contributor.localauthor | Kim, DoHyun | - |
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