Creep Deformation of Microstructurally Stable Sn-3.5Ag-xBi Solders
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yu, Jin | - |
| dc.contributor.author | Shin, SW | - |
| dc.date.accessioned | 2013-03-16T19:31:11Z | - |
| dc.date.available | 2013-03-16T19:31:11Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001 | - |
| dc.identifier.citation | Proc.3rd Electronic Materials and Packaging, v., no., pp.229 - 234 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/134967 | - |
| dc.language | ENG | - |
| dc.title | Creep Deformation of Microstructurally Stable Sn-3.5Ag-xBi Solders | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 229 | - |
| dc.citation.endingpage | 234 | - |
| dc.citation.publicationname | Proc.3rd Electronic Materials and Packaging | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Shin, SW | - |
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