DC Field | Value | Language |
---|---|---|
dc.contributor.author | 유진 | - |
dc.contributor.author | Song, JY | - |
dc.date.accessioned | 2013-03-16T19:30:08Z | - |
dc.date.available | 2013-03-16T19:30:08Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2000 | - |
dc.identifier.citation | IMAPS Korea 2000 , Fall Symp. Dankuk Univ., v., no., pp.107 - 111 | - |
dc.identifier.uri | http://hdl.handle.net/10203/134953 | - |
dc.language | KOR | - |
dc.title | T Peel 테스트에 의한 Cu/Cr/Polyimide계의 계면파괴에너지 평가(Estimation of Interfacial Fracture Energy of Cu/Cr/Polyimide System by T Peel Test) | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 107 | - |
dc.citation.endingpage | 111 | - |
dc.citation.publicationname | IMAPS Korea 2000 , Fall Symp. Dankuk Univ. | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | 유진 | - |
dc.contributor.nonIdAuthor | Song, JY | - |
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