Anisotropic Conductive Film (ACF) Flip-chip Interconnect in Over GHz RF Clock Distributioin System
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Ryu, Woonghwan | ko |
| dc.contributor.author | Yim, Myung-Jin | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-16T18:56:45Z | - |
| dc.date.available | 2013-03-16T18:56:45Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2000-06 | - |
| dc.identifier.citation | IEEE Adhesive 2000, pp.153 - 158 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/134586 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Anisotropic Conductive Film (ACF) Flip-chip Interconnect in Over GHz RF Clock Distributioin System | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000165846100027 | - |
| dc.identifier.scopusid | 2-s2.0-0003606779 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 153 | - |
| dc.citation.endingpage | 158 | - |
| dc.citation.publicationname | IEEE Adhesive 2000 | - |
| dc.identifier.conferencecountry | FI | - |
| dc.identifier.conferencelocation | Helsinki | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Ryu, Woonghwan | - |
| dc.contributor.nonIdAuthor | Yim, Myung-Jin | - |
| dc.contributor.nonIdAuthor | Paik, Kyung-Wook | - |
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.