Integrity Analysis of Solder Joints: Fracture Mechanics Approach
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Earmme, Youn-Young | - |
| dc.date.accessioned | 2013-03-16T18:34:39Z | - |
| dc.date.available | 2013-03-16T18:34:39Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001 | - |
| dc.identifier.citation | Third International Symposium on Electronics Materials and Packaging,2001, v., no., pp.404 - 411 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/134388 | - |
| dc.language | ENG | - |
| dc.title | Integrity Analysis of Solder Joints: Fracture Mechanics Approach | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 404 | - |
| dc.citation.endingpage | 411 | - |
| dc.citation.publicationname | Third International Symposium on Electronics Materials and Packaging,2001 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Earmme, Youn-Young | - |
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