Experimental Determination of Thin Film Adhesion Using 4 Point Bending Specimen

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Publisher
Third International Symposium on Electronics Materials and Packaging 2001
Issue Date
2001-11
Language
English
Citation

Third International Symposium on Electronics Materials and Packaging 2001, pp.376 - 381

URI
http://hdl.handle.net/10203/134387
Appears in Collection
ME-Conference Papers(학술회의논문)
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