Development of New 3-Dimensional (3-D) Memory Die Stacking Package
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 백경욱 | - |
| dc.date.accessioned | 2013-03-16T16:10:50Z | - |
| dc.date.available | 2013-03-16T16:10:50Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1999-02-01 | - |
| dc.identifier.citation | 제6회 한국반도체 학술대회, v., no., pp.271 - 272 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/133025 | - |
| dc.language | KOR | - |
| dc.publisher | 한국반도체 학술대회 | - |
| dc.title | Development of New 3-Dimensional (3-D) Memory Die Stacking Package | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 271 | - |
| dc.citation.endingpage | 272 | - |
| dc.citation.publicationname | 제6회 한국반도체 학술대회 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 백경욱 | - |
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