Reliability Assessments of Flip Chip Solder Joints with experimental and Numerical Methods
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.contributor.author | Ham, SJ | - |
| dc.date.accessioned | 2013-03-16T15:42:47Z | - |
| dc.date.available | 2013-03-16T15:42:47Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1999 | - |
| dc.identifier.citation | Workshop on Flip Chip Packaging, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/132753 | - |
| dc.language | KOR | - |
| dc.title | Reliability Assessments of Flip Chip Solder Joints with experimental and Numerical Methods | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | Workshop on Flip Chip Packaging | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Ham, SJ | - |
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