Evaluation of Thermal Shear Strains in Flips-chip Package by Electronic Speckle Pattern Interferometry (ESPI)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jang, W | - |
| dc.contributor.author | Lee, BW | - |
| dc.contributor.author | Kim, DW | - |
| dc.contributor.author | Nah, JW | - |
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.contributor.author | Kwon, D | - |
| dc.date.accessioned | 2013-03-16T14:11:35Z | - |
| dc.date.available | 2013-03-16T14:11:35Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-11 | - |
| dc.identifier.citation | Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, v., no., pp.310 - 314 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/132002 | - |
| dc.language | ENG | - |
| dc.title | Evaluation of Thermal Shear Strains in Flips-chip Package by Electronic Speckle Pattern Interferometry (ESPI) | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 310 | - |
| dc.citation.endingpage | 314 | - |
| dc.citation.publicationname | Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Jang, W | - |
| dc.contributor.nonIdAuthor | Lee, BW | - |
| dc.contributor.nonIdAuthor | Kim, DW | - |
| dc.contributor.nonIdAuthor | Nah, JW | - |
| dc.contributor.nonIdAuthor | Kwon, D | - |
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