Electroless Ni Bumped Flip Chip Interconnection on an Organic Substrate using Anisotropic Conductive Adhesives/Films (ACAs/ACFs)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2013-03-16T13:48:40Z | - |
| dc.date.available | 2013-03-16T13:48:40Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1999-03-01 | - |
| dc.identifier.citation | Int. Advanced Tech. Workshop on Flip Chip Technology, v., no., pp.0 - 0 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/131876 | - |
| dc.language | ENG | - |
| dc.title | Electroless Ni Bumped Flip Chip Interconnection on an Organic Substrate using Anisotropic Conductive Adhesives/Films (ACAs/ACFs) | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 0 | - |
| dc.citation.endingpage | 0 | - |
| dc.citation.publicationname | Int. Advanced Tech. Workshop on Flip Chip Technology | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
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