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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

The Effect of Cu Addition to Sn-3.5Ag Solder Joint

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dc.contributor.authorLee, Hyuck Mo-
dc.contributor.authorChoi, WK-
dc.contributor.authorJeong, SW-
dc.date.accessioned2013-03-16T13:31:37Z-
dc.date.available2013-03-16T13:31:37Z-
dc.date.created2012-02-06-
dc.date.issued2001-12-11-
dc.identifier.citationThe 4th Pacific Rim International Conference on Advanced Materials and Processing, v., no., pp.1031 - 1034-
dc.identifier.urihttp://hdl.handle.net/10203/131780-
dc.languageENG-
dc.titleThe Effect of Cu Addition to Sn-3.5Ag Solder Joint-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage1031-
dc.citation.endingpage1034-
dc.citation.publicationnameThe 4th Pacific Rim International Conference on Advanced Materials and Processing-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorLee, Hyuck Mo-
dc.contributor.nonIdAuthorChoi, WK-
dc.contributor.nonIdAuthorJeong, SW-
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MS-Conference Papers(학술회의논문)
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