Significant Reliablity Enhancement Using New Anisotropic Conductive Adhesives for Flip Chip on Organic Substrates Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Kwon, WS | ko |
| dc.contributor.author | Yim, MJ | ko |
| dc.date.accessioned | 2013-03-16T13:13:46Z | - |
| dc.date.available | 2013-03-16T13:13:46Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-02-01 | - |
| dc.identifier.citation | 2001 Pan Pacific Microelectronics Symposium, pp.217 - 223 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/131628 | - |
| dc.language | English | - |
| dc.publisher | Pan Pacific Microelectronics Symposium | - |
| dc.title | Significant Reliablity Enhancement Using New Anisotropic Conductive Adhesives for Flip Chip on Organic Substrates Applications | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000176732600027 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 217 | - |
| dc.citation.endingpage | 223 | - |
| dc.citation.publicationname | 2001 Pan Pacific Microelectronics Symposium | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kwon, WS | - |
| dc.contributor.nonIdAuthor | Yim, MJ | - |
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