DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ham, SJ | ko |
dc.contributor.author | Lee, Soon-Bok | ko |
dc.contributor.author | Kim, DH | ko |
dc.date.accessioned | 2013-03-16T13:05:02Z | - |
dc.date.available | 2013-03-16T13:05:02Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2000-06 | - |
dc.identifier.citation | Experimental/Numerical Mechanics in Electronic Packaging, pp.738 - 739 | - |
dc.identifier.uri | http://hdl.handle.net/10203/131553 | - |
dc.language | English | - |
dc.publisher | Experimental/Numerical Mechanics in Electronic Packaging | - |
dc.title | Measurement of Creep and Relaxation Behaviors of CSP using Moire Interferometry | - |
dc.type | Conference | - |
dc.identifier.wosid | 000176203100198 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 738 | - |
dc.citation.endingpage | 739 | - |
dc.citation.publicationname | Experimental/Numerical Mechanics in Electronic Packaging | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Orlando | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Ham, SJ | - |
dc.contributor.nonIdAuthor | Kim, DH | - |
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