A study on the thermal deformation of ACF assemblies using Moiré interferometry and FEM
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hwang, TK | ko |
| dc.contributor.author | Ham, SJ | ko |
| dc.contributor.author | Lee, Soon-Bok | ko |
| dc.date.accessioned | 2013-03-16T13:04:46Z | - |
| dc.date.available | 2013-03-16T13:04:46Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2000-11 | - |
| dc.identifier.citation | Int. Symposium on Electronic Materials and Packaging, pp.358 - 363 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/131551 | - |
| dc.language | English | - |
| dc.publisher | Int. Symposium on Electronic Materials and Packaging | - |
| dc.title | A study on the thermal deformation of ACF assemblies using Moiré interferometry and FEM | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000167673300055 | - |
| dc.identifier.scopusid | 2-s2.0-84954541513 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 358 | - |
| dc.citation.endingpage | 363 | - |
| dc.citation.publicationname | Int. Symposium on Electronic Materials and Packaging | - |
| dc.identifier.conferencecountry | HK | - |
| dc.identifier.conferencelocation | Hong Kong | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Hwang, TK | - |
| dc.contributor.nonIdAuthor | Ham, SJ | - |
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