하니컴형 성형촉매와 흡착제를 이용한 다이옥신 제거공정 개발
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Son Ki Ihm | - |
| dc.date.accessioned | 2013-03-16T12:48:59Z | - |
| dc.date.available | 2013-03-16T12:48:59Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2000-01-01 | - |
| dc.identifier.citation | , v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/131427 | - |
| dc.language | KOR | - |
| dc.title | 하니컴형 성형촉매와 흡착제를 이용한 다이옥신 제거공정 개발 | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Son Ki Ihm | - |
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- CBE-Conference Papers(학술회의논문)
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