DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Ham, SJ | - |
dc.date.accessioned | 2013-03-16T10:24:47Z | - |
dc.date.available | 2013-03-16T10:24:47Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2001 | - |
dc.identifier.citation | , v., no., pp.3 - 45 | - |
dc.identifier.uri | http://hdl.handle.net/10203/130337 | - |
dc.language | KOR | - |
dc.title | Mechanical Reliability of Electronics Packaging | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 3 | - |
dc.citation.endingpage | 45 | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Ham, SJ | - |
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