DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Park, Tae-Sang | - |
dc.date.accessioned | 2013-03-16T10:13:53Z | - |
dc.date.available | 2013-03-16T10:13:53Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2002 | - |
dc.identifier.citation | The International Symposium on Electronic Materials and Packaging 2002, v., no., pp.317 - 323 | - |
dc.identifier.uri | http://hdl.handle.net/10203/130216 | - |
dc.language | ENG | - |
dc.title | Cyclic Stress-Strain Measurement Tests of Sn3. 5Ag0.75C u Solder Joint | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 317 | - |
dc.citation.endingpage | 323 | - |
dc.citation.publicationname | The International Symposium on Electronic Materials and Packaging 2002 | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Park, Tae-Sang | - |
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