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Showing results 1 to 4 of 4

1
Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages

Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05

2
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)

Suk, Kyoung-Lim; Choo, Kyo-Sung; Kim, Sung-Jin; Kim, Jong-Soo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1182 - 1188, 2012-06

3
Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07

4
Warpage behavior of chip-on-flex(COF) package under thermal cycling condition

Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11

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