Browse "Dept. of Mechanical Engineering(기계공학과)" by Author On, Seung Yoon

Showing results 1 to 24 of 24

1
CORE-SHELL STRUCTURED FIBER TYPE STRAIN SENSOR AND METHOD OF MANUFACTURING THE SAME

Kim, Seong Su; On, Seung Yoon

2
Design of periodic arched structures integrating the structural nonlinearity and band gap effect for vibration isolation

On, Seung Yoon; Moon, Hyemi; Park, Seong Yeon; Ohm, Tae Woong; Kim, Wonvin; Kim, Seong Su, MATERIALS & DESIGN, v.224, 2022-12

3
Development of a spread-tow fabric composite bipolar plate with fiber-spreading effect for vanadium redox flow battery

Choe, Jaeheon; Lee, Dongyoun; On, Seung Yoon; Kim, Seong Su; Jun Woo Lim, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.176, 2024-01

4
Dry- jet wet spun core-shell structured strain sensors for damage monitoring of the composite structures

Kim, Seong Su; On, Seung Yoon, Frontiers in polyumer science, Materialstoday, 2019-05-07

5
Dynamic characteristics of composite tilting pad journal bearing for turbine/generator applications

On, Seung Yoon; Kim, Yun Seong; You, Jun Il; Lim, Jun Woo; Kim, Seong Su, COMPOSITE STRUCTURES, v.201, pp.747 - 759, 2018-10

6
Effect of sizing agents of carbon fibers on flow characteristics of epoxy resin

Lim, Su-Hyun; On, Seung Yoon; Kim, Seong Su, Emerging Technologies in Mechanical Engineering, The Korean Society of Mechanical Engineers, 2018-08-20

7
EFFECTS OF MICROWAVE-ASSISTED CROSS-LINKING ON THE CREEP RESISTANCE AND MEASUREMENT ACCURACY OF THE COAXIAL-STRUCTURED FIBER STRAIN SENSOR

On, Seung Yoon; Kim, Seong Su, 20th European Conference on Composite Materials: Composites Meet Sustainability, ECCM 2022, pp.1056 - 1061, Composite Construction Laboratory (CCLab), Ecole Polytechnique Federale de Lausanne (EPFL), 2022-06

8
Effects of Microwave-Assisted Cross-Linking on the Creep Resistance and Sensing Accuracy of a Coaxial-Structured Fiber Strain Sensor

On, Seung Yoon; Park, Seong Yeon; Chung, Yong Sik; Kim, Seong Su, ADVANCED MATERIALS TECHNOLOGIES, v.8, no.6, 2023-03

9
Effects of post-treatment of meta-aramid nanofiber mats on the adhesion strength of epoxy adhesive joints

On, Seung Yoon; Kim, Moo Sun; Kim, Seong Su, COMPOSITE STRUCTURES, v.159, pp.636 - 645, 2017-01

10
Effects of process-induced residual stress and geometric characteristics on pressure-resisting capability of corrugation in primary barriers of liquefied natural gas carriers

Park, Seong Yeon; Kim, Woe Tae; Choi, Jae Hoon; On, Seung Yoon; Kim, Seong Su, OCEAN ENGINEERING, v.237, 2021-10

11
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles

Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.8, pp.11024 - 11032, 2023-01

12
In-situ resin flow monitoring in VaRTM process by using optical frequency domain reflectometry and long-gauge FBG sensors

Jeonjavascript:fn_save();g, Jae-Moon; Eum, Soohyun; On, Seung Yoon; Kageyama, Kazuro; Murayama, Hideaki; Uzawa, Kiyoshi; Kim, Seong Su, COMPOSITE STRUCTURES, v.282, 2022-02

13
Optimum boundaries for maximum load-carrying capacity in water-lubricated composite journal bearings incorporating turbulences and inertial effects based on elastohydrodynamic analysis

Kim, Wonvin; Lim, Suhyun; Hong, Hyunsoo; Jeong, Kwang Il; On, Seung Yoon; Park, Seong Yeon; You, Jun Il; et al, JOURNAL OF COMPUTATIONAL DESIGN AND ENGINEERING, v.9, no.6, pp.2506 - 2523, 2022-11

14
Preparation and Characterization of Hybrid Structured MWCNT/UHMWPE Fiber Sensors for Strain Sensing and Load Bearing of Composite Structures

On, Seung Yoon; Park, Steve; Kim, Seong Su, ADVANCED MATERIALS TECHNOLOGIES, v.4, no.12, pp.1900807, 2019-12

15
Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements

Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.32, pp.38750 - 38758, 2023-08

16
Research trends and future perspective in nonconventional machining of fiber-reinforced polymers: a review

Kim, Wonvin; Lim, Su Hyun; Kang, Dajeong; Bae, Sangyoon; On, Seung Yoon; Kim, Seong Su, FUNCTIONAL COMPOSITES AND STRUCTURES, v.3, no.2, 2021-06

17
Resin impregnation and interfacial adhesion behaviors in carbon fiber/ epoxy composites: Effects of polymer slip and normalized surface free energy with respect to the sizing agents

Lim, Su Hyun; On, Seung Yoon; Kim, Hyoungsoo; Bang, Yun Hyuk; Kim, Seong Su, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.146, 2021-07

18
Structural optimization of an arch-structured epoxy/rubber composite vibration isolator using deep Q-value neural network reinforcement learning

Hong, Hyunsoo; Jeong, Kwang Il; On, Seung Yoon; Kim, Wonvin; Kim, Seong Su, COMPOSITE STRUCTURES, v.323, 2023-11

19
Study of the endurance performance of composite journal bearings under the oil cut situation

Choe, Kang Yeong; On, Seung Yoon; Song, Seung A.; Lim, Jun Woo; You, Jun Il; Kim, Seong Su, COMPOSITE STRUCTURES, v.134, pp.772 - 781, 2015-12

20
Study on on the Flow Characteristics of the Epoxy Resin w.r.t. Sizing Materials of Carbon Fibers

Lim, Su-Hyun; On, Seung Yoon; Kim, Seong-Su, COMPOSITES RESEARCH, v.31, no.6, pp.379 - 384, 2018-12

21
Study on the core-shell structured fiber type strain sensor with load bearing characteristics in composite structures

On, Seung Yoon; Kim, Seong Su, 22nd International Conference on Composite Materials, ICCM 2019, International Committee on Composite Materials, 2019-08

22
STUDY ON THE PHYSICAL AND CHEMICAL COMPATIBILITY BETWEEN EPOXY RESIN AND CARBON FIBERS WITH RESPECT TO VARIOUS SIZING AGENTS

Lim, Su Hyun; On, Seung Yoon; Kim, Seong Su, 26th International Conference on Composite/Nano Engineering, ICCE, 2018-07-17

23
외골격 로봇을 위한 마찰전기 기반의 자체 에너지 하베스팅이 가능한 복합재료 스프링

Hong, Hyunsoo; Jeong, Kwang Il; Kim, Wonvin; Jo, Hyeonseong; On, Seung Yoon; Jeong, Jae -moon; Kim, Seong Su, TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A, v.47, no.5, pp.465 - 469, 2023-05

24
초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발

Park, Seong Yeon; On, Seung Yoon; Kim, Seong Su, COMPOSITES RESEARCH, v.34, no.1, pp.47 - 50, 2021-02

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