Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Jang, Jae-Won
Showing results 1 to 12 of 12
| A graphene meta-interface for enhancing the stretchability of brittle oxide layers Won, Sejeong; Jang, Jae-Won; Choi, Hyung-Jin; Kim, Chang-Hyun; Lee, Sang Bong; Hwangbo, Yun; Kim, Kwang-Seop; et al, NANOSCALE, v.8, no.9, pp.4961 - 4968, 2016 |
| An Advanced Thermal Cycling Test for Reliability Assessment of a Stack Package Lee, Soon-Bok; Jang, Jae-Won, EMAP2011, 2011-12 |
| Analysis of a complete contact problem in bonded condition: Comparison of experimental-numerical analyses and theoretical solutions Kim, Hyung-Kyu; Jang, Jae-Won; Lee, Soon-Bok, TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A, v.39, no.6, pp.583 - 588, 2015-06 |
| In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moire Method With a Pseudo-Phase-Shifting Technique Jang, Jae-Won; Park, Jin-Hyoung; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.1992 - 2000, 2012-12 |
| Interlayer non-coupled optical properties for determining the number of layers in arbitrarily stacked multilayer graphenes Hwangbo, Yun; Lee, Choong-Kwang; Mag-Isa, Alexander E.; Jang, Jae-Won; Lee, Hak-Joo; Lee, Soon-Bok; Kim, Seong Su; et al, CARBON, v.77, pp.454 - 461, 2014-10 |
| Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05 |
| Numerical and experimental investigation of a complete contact problem by comparing with an asymptotic analysis Jang, Jae-Won; Kim, Hyung-Kyu; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.82, pp.39 - 46, 2016-03 |
| Statistical Characteristics of Fatigue Failure of Copper Thin Films Jang, Jae-Won; Hwangbo, Yun; Kim, Jae-Hyun; Lee, Hak-Joo; Mag-isa, Alexander E.; Lee, Soon-Bok, JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, v.135, no.4, 2013-10 |
| Thermally Induced Deformation Measurement of Through-Silicon Via (TSV) Structures using an Atomic Force Microscope (AFM) Moiré Method Jang, Jae-Won; Lee, Soon-Bok, IEEE Nano 2012, IEEE, 2012-08-20 |
| Thermo-mechanical reliability evaluation of thin electronic packages with high density interconnects = 고집적 연결부를 가진 얇은 전자 패키지의 열적 기계적 신뢰성 평가link Jang, Jae-Won; 장재원; et al, 한국과학기술원, 2014 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
| Warpage behavior of chip-on-flex(COF) package under thermal cycling condition Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11 |
Discover
Open Access
Date issued
- 4,418 2020 - 2024
- 12,350 2010 - 2019
- 10,774 2000 - 2009
- 6,220 1990 - 1999
- 1,879 1980 - 1989