Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Ha T.H.
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| Low temperature hybrid bonding using self-alignment Lee J.H.; Ha T.H.; Lee C.W.; Song J.-Y.; Yoo C.D., 3rd Electronics System Integration Technology Conference, ESTC 2010, 2010-09-13 |
| Pre-bonding method using self-alignment effect for multichip packaging Lee J.H.; Ha T.H.; Lee C.W.; Song J.-Y.; Cha M.S.; Yoo C.D., 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, pp.118 - 123, 2009-11-17 |
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