Browse "Dept. of Mechanical Engineering(기계공학과)" by Author 668
Showing results 1 to 60 of 177
| A comparative study of fatigue behavior of SnAgCu and SnPb solder joints Lee, Soon-Bok; Kim, Ilho; Park, Tae-Sang, KAIST-Tokyo Tech Joint Workshop, 2004 |
| A comparative study on thermal and mechanical fatigue behavior for Lead-Free Solder Joints Lee, Soon-Bok; Kim, Ilho, EMAP2006, 2006 |
| A Compartive Study on Thermal and Mechanical Fatigue Behavior of Lead-free Solder Joints Kim, Ilho; Lee, Soon-Bok, ECF16, pp.366 -, 2006 |
| A life prediction method in thermomechanical fatigue condition of ferritic stainless steels Lee, Soon-Bok; Lee, KO; Bae, KH, Fatigue Damage of Structural Materials VII, 2008 |
| A multiaxial fatigue testing facility for combined torsion and bending, 4th Conference of Asian-Pacific Congress on Strength Evaluation (A.P.C.S.) Lee, Soon-Bok, International Academic Publishers, pp.1476 - 1481, 1991 |
| A new high temperature life prediction model of austenitic and ferritic stainless steel Lee, Soon-Bok; Lee, Keum-Oh; Hong, Seong-Gu; Yoon, Samson, Int. Conference on Fatigue Damage of Structural Materials, 2004 |
| A Novel Method of Strain Measurement with Optical Properties of Nano Materials Jang, Dong Won; Kim, Inyong; Seo, Daeha; Lee, Soon Bok, Asian Conference on Experimental Mechanics(ACEM) 2016, KSME Materials and Fracture Division / Reliability Division, 2016-11-13 |
| A Parametric Study on the Thermal Fatigue Reliability of Flip Chip Solder Joints in Electronic Packaging Kim, JY; Lee, Soon-Bok, 1996 Int. Symposium on Experimental/numerical Mechanics in Electronic Packaging, pp.33 - 34, 1996 |
| A Stochastic Modeling of Multiaxial Fatigue Life and Damage Accumulation of SM45C Steel Lee, BH; Lee, Soon-Bok, Int. Conf. on Biaxial/Multiaxial Fatigue and Fracture, pp.593 - 607, 1997 |
| A Stochastic Modeling of Variable Multiaxial Low Cycle Fatigue of 316L Stainless Steel Lee, BH; Kwon, HJ; Lee, Soon-Bok, KSME 99 Conference of Materials and Fracture Division, KSME 99 MF13, pp.88 - 95, 1999 |
| A Study of In-Plane Micro-Moire Technique using Phase-Shifting Method Yang, SY; Ham, SJ; Lee, Soon-Bok, KSME 2000 Conference of Materials and Fracture Division, pp.294 - 300, 2000-02 |
| A study on reliability of flip-chip solder joints using Pb-free solders and electroless Ni-P UBMs Lee, Soon-Bok; Paik, KW; Jeon, YD; Yang, SY; Kwon, YM, Pan Pacific Microelectronics symposium, 2005 |
| A study on the Applicability of Stress Strain Approximation Methods at a Notch Tip Lim, JY; Lee, Soon-Bok, KSME2002 Conference, 2002 |
| A Study on the calculation of stress intensity factor for a patched crack using approximate weight function Kim, JH; Lee, Soon-Bok, KSME Fall Annual Meering A, pp.123 - 128, 2000-11 |
| A Study on the Corner Crack Growth at a Hole Using a Laser Interferometry Strain/Displacement Gage Lee, Soon-Bok; Kim, JH, International Session of JSME Spring Conference of JSME, pp.589 - 591, 1994 |
| A study on the measurement of mechanical properties for nickel thin film Park, TS; Baek, DC; Lee, Soon-Bok, The Autumn Conference of KSME 2002, 2002 |
| A Study on the Stress Intensity Factors of an Oblique Crack under Traction and Extension Loads Kim, HK; Lee, Soon-Bok, Int. conf. on Mechanics and Materials Engineering (MSME-95), pp.829 - 834, 1995 |
| Accelerated Testings and Reliability Assessments of Solder Joints in Electronics Packaging Lee, Soon-Bok; Ham, Suk-Jin, SEMICON Korea Technical Symposium 99, 1999 |
| Acceleration Test of Solder Joints with Pseudo-Power Cycling Lee, Soon-Bok; Kim, IH, Korea Reliability Society, pp.32 - 39, 2006 |
| ACF 패키지 구성물질에 대한 흡습 특성 연구 윤지영; 김일호; 이순복, KSME 추계학술대회, 2006 |
| AFM Observations and Finite Element Analysis of Cracks of Thin Films on Substrates Lee, Soon-Bok; Bae, Keun-Ho; Baek, DC, Tokyo Tech-KAIST joint workshop, pp.48 - 49, 2005 |
| An Advanced Thermal Cycling Test for Reliability Assessment of a Stack Package Lee, Soon-Bok; Jang, Jae-Won, EMAP2011, 2011-12 |
| An Analysis of the effecu of casting conditions on microstructure using PROCAST Lee, Soon-Bok; Lim, JY; Lee, ZH, KSME 2001 Conference of Materials and Fracture Division, KSME 01MF009, pp.51 - 57, 2001 |
| An Energy Based Low Cycle Fatigue Life Prediction Model of 316L Stainless Steel at Elevated Temperature Hong, S.G; Lee, Soon-Bok, APCFS & ATEM'01, pp.428 - 433, 2001 |
| An Evaluation of Thermal Deformation Behavior in Electronic Package Using UV Moire Interferometry Lee, Soon-Bok; Park, Jin-Hyung, Tokyo Tech-KAIST joint workshop, pp.34 - 35, 2005 |
| An evaluation of thermal deformation behavior in electronics package using UV moire interferometry Lee, Soon-Bok; Park, Jin-Hyung, 2005 KSME Spring Conference, pp.10 - 10, 2005 |
| An Experimental Study on the Integrity of the Electronic Pakaging Subjected to Environmental Vibration Ham, SJ; Lee, Soon-Bok, 1995 SEM Spring Conference on Experimental Mechanics, pp.713 - 719, 1995 |
| Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF Lee, Soon-Bok; Paik, Kyung-Wook; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002 |
| Application of Comtinum Damage Model to Life Prediction of Geometrically Nonlinear Structure in High Temperature Youn, SS; Lee, Soon-Bok; Kim, JB; Lee, HY; Yoo, B, Korea Society of Atomic Power, 2000-05 |
| Assessment of material damage at high temperatures by measurement of damage process zone Lee, Soon-Bok; Bae, Keun-Ho; Lee, Keum-Oh; Jung, YU; Kim, SH, Fatigue Damage of Structural Materials VII, 2008 |
| Assessment of Reliability of Non-Conductive Film (NCF) Package having High Glass Transition Temperature 06RE024 박진형; 이순복, 대한기계학회 신뢰성부문 및 한국신뢰성학회 공동학술대회, pp.141 - 145, 2006 |
| Behavior of plasticity-induced and roughness-induced fatigue crack closure in aluminum alloy Kim, JH; Lee, Soon-Bok, , 2000 |
| Calculation of local stree-strain behavior at notches for non-masing material under cyclic loading Lee, Soon-Bok; Lim, Jae-Yong, APCFS(Asian Pacific Conf for Fracture and Strength)'04, pp.356 - 356, 2004 |
| Calculation of Local Stress-Strain under Cyclic Loading Using Incremental Neuber and Glinka Approximation Lee, Soon-Bok, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Calculation of Stress Intensity Factor of a Patched Crack Plate with Finite Thickness under Out-of-Plane Bending Kim, JH; Lee, Soon-Bok, Proceedings of the KSME 2000 Spring Annual Meering, pp.165 - 169, 2000-04 |
| Calculation of Stress Intensity Factor Weight Function Method for a Patched Crack Plate Kim, JH; Suh, DC; Lee, Soon-Bok; Lee Jung Joo, KSME2000 Conference of Materials and Fracture Division, pp.15 - 20, 2000-02 |
| Characterization of piezoelectric properties of ZnO nanowire using AFM Won, SJ; Lee, WS; Lee, JH; Hong, SG; Lee, Soon-Bok, POWER MEMS2011, 2011-11 |
| Chip warpage damage model for ACA/NCA film type electronic packages Lee, Soon-Bok; Yang, Se Young; Kwon, Woon-Seong; Paik, Kyoung-Wook, APCFS(Asian Pacific Conf for Fracture and Strength)'04, pp.103 - 103, 2004 |
| Computational Mechanics Aided Reliability Assessment of Interconnections in Advanced Electronics Packaging Lee, Soon-Bok; Park, TS; Ham, SJ, WCCM VI, 2004 |
| Computer Simulation of Intergranular Failure by r-type Cavitation Model Lee, Soon-Bok; Miller, AK, Proc. of KSME/JSME Fracture and Strength '90, pp.19 - 24, 1990 |
| Constitute Behaviors of BGA Solder Joints in Electronic Packaging Lee, Soon-Bok, InterPACK'03, 2003-01-01 |
| Constitutive modeling of ferritic stainless steels for automotive engine application Lee, Soon-Bok; Lee, KO; Bae, KH; Kim, Sangho; Park, Sejong, Int. Conf. on Structural Engineering, Mechanics and Computation(SEMC), pp.211 - 212, 2007 |
| Crack Propagation in Plates under Mixed-Mixed-Mode Impact Fatigue Loading Lee, Soon-Bok; Noh, SI, International Symposium on Impact Engineering(ISIE), pp.355 - 360, 1992 |
| Crack Propagation Model for High Temperature Structures under Creep-Fatigue Loading Lee, Soon-Bok; Kim, JY, Localized Damage '94, pp.39 - 46, 1994 |
| Creep and Relaxation Behaviors of SnAgCu vs 63/Sn/Pb Solder Joints on Wafer-Level CSP Lee, Soon-Bok; Ham, SJ; Kim, DH, , 2001 |
| Creep Fracture Mechanism and Creep Constitute Equation for 304 Stainless Steel Kim, JY; Lee, Soon-Bok; Huh, YH, Aging Degradation Sysmposium, pp.98 - 103, 1999 |
| Cyclic Loading Behavior of Solder Joints in Electronic Packaging Park, Tae-Sang; Lee, Soon-Bok, KSME 2003 Spring Conference, 2003 |
| Cyclic Stress-Strain Measurement Tests of Sn3. 5Ag0.75C u Solder Joint Lee, Soon-Bok; Park, Tae-Sang, The International Symposium on Electronic Materials and Packaging 2002, pp.317 - 323, 2002 |
| Definition of damage parameter in low-cycle fatigue of gray cast iron Lee, KO; Lee, Soon-Bok, Key Engineering Materials, v.345-346, pp.367 - 370, Trans Tech Publications Ltd., 2007-08 |
| Determination of Material Constants of Creep Constitutive Equation Lee, Soon-Bok; Kim, Jin-Young; Huh, Yong-Hak, KSME Spring Conference, KSME 99S126, pp.783 - 787, 1999 |
| Development of a Creep-fatigue life prediction model for type 316L stainless steels Lee, Jun Youn; Lee, Soon-Bok, ATEM'03, pp.GSW - 309, 2003 |
| Development of a structural fatigue testing machine and its application Lee, Soon-Bok, Proc. of the first Asian-Pacific Colloquium on strength Evaluation(A.P.C.S), pp.51 - 60, 1984 |
| Development of Viscoplastic Finite Element Analysis Program using Arbitrary State Variables Kim, JY; Lee, Soon-Bok; Huh, YH, KSME1999 Fall Conference, KSME 99F051, pp.296 - 301, 1999 |
| Die Shear test of the coined solder bumps package with various UBM and solder materials Lee, Soon-Bok; Hwang, TK; Nah, JW; Paik, KW, , 2003 |
| Dynamic Strain Agging under Tensile and LCF Loading Conditions in some Alloys Lee, KO; Lee, Soon-Bok; Hong, SHong G, International Fatigue Congress, 2006 |
| Dynamic strain aging and pre-straining effects on the fatigue resistance of type 316L stainless steel Lee, Soon-Bok; Hong, Seong-Gu; Lee, KO, Int. Conference on Fatigue Damage of Structural Materials, 2004 |
| Dynamic Strain Aging Effect on the Cyclic Stress Response and Fatigue Resistance of Type 316 Stainless Steel Lee, Soon-Bok; Hong, Seong-Gu, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Dynamic Strain Aging under Tensile Loading Conditions in Some High-Temperature Alloys Lee, Soon-Bok; Lee, Keum-Oh, 2006 KSME Spring Conference, 2006 |
| Effect of a brazing process on mechanical and fatigue behavior of alclad aluminum 3005 Kim, Hyun-Ho; Lee, Soon-Bok, ICMR2011, 2011-11 |
| Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF) Park, JH; Chung, CK; Paik, KW; Lee, Soon-Bok, International Confernce on Experimental Mechanics, 2006, v.326-328 I, pp.517 - 520, 2006 |
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