Browse "Dept. of Mechanical Engineering(기계공학과)" by Author 1762
Showing results 1 to 41 of 41
| 3D 다공성 유전층을 활용한 정전용량형 유연 압력센서의 특성 분석 권동욱; 이태익; 김민성; 김승환; 김택수; 박인규, 2015 대한기계학회 춘계학술대회, 대한기계학회, 2015-05-22 |
| A Flexible Piezoresistive Pressure Sensor Based on Carbon Nanotube-Coated Porous Elastomer and Development of Flexible Piano Pad Kim, Seunghwan; Amzadi, Morteza; Lee, Tae Ik; Jeong, Y; Kwon, Donguk; Kim, Min Seong; Kim, Taek Soo; et al, APCOT2016, APCOT, 2016-06-28 |
| Adhesion Characteristic of Graphene Synthesized on Cu Yoon, T.; Shin, W.C.; Mun, J.H.; Cho, Byung Jin; Kim, Taek-Soo, Materials Research Society Fall Meeting, Materials Research Society (MRS), 2013-12-01 |
| Adhesion Characteristics of Screen-printed Ag Nanopaste Thin Films Kim, Jae Han; Jang, KR; Jung, SB; Kim, Taek Soo, 17th International Conference on Electronics Materials and Packaging, EMAP, 2015-09 |
| Adhesion Energy and Etching-Free Renewable Transfer of Graphene As-Grown on Copper Yoon, Taesik; Shin, Woo Cheol; Kim, Taek Yong; Mun, Jeong Hun; Cho, Byung Jin; Kim, Taek-Soo, The Electrochemical Society Meeting, ECS, 2012-10-07 |
| Adhesion of Silver Ion Ink Films on Flexible Substrates Choi, H; Kim, Jae Han; Kim, Taek-Soo, ACEM2016, ACEM, 2016-11-16 |
| Analyses of Warpage Orientation Change due to Viscoelastic Properties of FR-4 Polymer Substrate during Thermal Process Kim, Choelgyu; Lee, Tae Ik; Kim, MS; Kim, Taek Soo, 2015 KSPE Autumn conference, 한국정밀공학회, 2015-12-17 |
| Carbon nanotube-coated elastomer sponge based flexible piezoresistive pressure sensor and application to flexible piano pad 김승환; 이태익; 정용록; 김택수; 박인규, The Korean Sensors Society Conference 2015, 한국센서학회, 2015-11 |
| Cohesive Toughness of Low-k Film with Periodically Changing Elastic Modulus: Cube-Corner Indentation Yeap, K.B.; Hangen, U; Ritz, Y; Kim, Taek-Soo; Dauskardt, R.H.; Zschech, E, Proceedings of Stress-Induced Phenomena in Metallization: 11th International Workshop, pp.159 - 165, Proceedings of Stress-Induced Phenomena in Metallization, 2010-01-01 |
| Controlled Multiple Neutral Planes by Low Elastic Modulus Adhesive Kim, Wansun; Lee, Inhwa; Kim, Taek-Soo, ACEM2016, ACEM, 2016-11-16 |
| Etching-Free Mechanical Transfer and Adhesion Measurement of Multilayer Graphene As-Grown on Nickel Kang, Sumin; Yoon, Taeshik; Kim, Taek-Soo, The 15th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2016-10-25 |
| Evaluation on Property and Reliability of Micro-bump Joint between Si Chip and Flexible Substrate Ko, Yongho; Kim, Taek-Soo; Lee, Changwoo, TMS 2014 143rd Annual Meeting, The Minerals, Metals & Materials Society(TMS), 2014-02-16 |
| Functionally Graded Hybrid Layers for High-Performance Polymer/Silicon Adhesion Kim, Taek-Soo; Giachino, M; N. Ananthakrishnan; S.M. Liff; R.H. Dauskardt, Materials Research Society 2011 Spring Meeting, Materials Research Society, 2011-04-25 |
| High-yield, polymer-free dry transfer of graphene with controlled strain rate and modulus of PDMS stamp Seo, Jeongmin; Kim, Choelgyu; Ma, Boosoo; Kim, Taek Soo, 8th International Conference on Recent Progress in Graphene/2D Research, Recent Progress in Graphene/2D Research, 2016-09-26 |
| Interfacial adhesion and diffusion barrier characteristics of synthesized graphene Yoon, Taeshik; Cho, Byung Jin; Kim, Taek-Soo, 2014 The World Conference on Carbon, Carbon, 2014-07-03 |
| Measurement of Adhesion and Mechanical Properties of Thin Films Kim, Taek-Soo, The Korean Microelectronics and Packaging Society 2015 Spring Meeting, 한국 마이크로 전자 및 패키징 학회, 2015-04-02 |
| Mechanical Properties of Functional Thin Films for Flexible Devices Kim, Taek Soo, 2016 Energy Materials Nanotechnology (EMN) Summer Meeting, Energy Materials Nanotechnology (EMN), 2016-06-11 |
| Mechanical Properties of Functional Thin Films for Flexible Devices Kim, Taek Soo, US-Korea Conference, UKC 2016, 2016-08-11 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, 대한금속재료학회 2015년 춘계학술대회, 대한금속재료학회, 2015-04-23 |
| Mechanical Reliability of Advanced Thin Films for Flexible Devices Kim, Taek Soo, 2016 International Conference on Electronics Packaging, International Conference on Electronics Packaging, 2016-04-22 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill Kim, Taek-Soo, Korea-SV Electronics Packaging Technology Workshop, Korea-SV Electronics Packaging Technology Workshop, 2010-10-21 |
| Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films Kim, Taek-Soo; R.H. Dauskardt, Materials Research Society 2010 Spring Meeting, Materials Research Society, 2010-04-05 |
| Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films Kim, Taek-Soo; R.H. Dauskardt, 2010 NCCAVS CMPUG, NCCAVS CMPUG, 2010-04-28 |
| Optimized CMP for Device Structure Containing Ultra-Low-k Dielectrics Kim, Taek-Soo; R.H. Dauskardt, SEMICON Korea, SEMICON, 2009-01-20 |
| Optimized CMP of Nanomaterials Kim, Taek-Soo; R.H. Dauskardt, 215th Electrochemical Society Meeting, Electrochemical Society, 2009-05-24 |
| Quantitative Roadmap for Optimizing CMP of Ultra-Low-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, IEEE International Interconnect Technology Conference , IEEE, 2008-06-01 |
| Quantitative Roadmap for Optimizing CMP of Ultralow-k Dielectrics Kim, Taek-Soo; Konno, T; Yamanaka, T; R.H. Dauskardt, Materials Research Society 2009 Spring Meeting, Materials Research Society, 2009-04-14 |
| Selective Electrodeposition of Metals to Heal Graphene Defects Yoon, Taeshik; Kim, Taek Soo, 8th International Conference on Recent Progress in Graphene/2D Research, Recent Progress in Graphene/2D Research, 2016-09-26 |
| Simultaneously Enhancing the Cohesion and Electrical Conductivity of PEDOT:PSS Conductive Polymer Films using DMSO Additives Lee, Inhwa; Kim, Gun Woo; Yang, Minyang; Kim, Taek Soo, 2015 KSPE Autumn conference, 한국정밀공학회, 2015-12-17 |
| Simultaneously Enhancing the Cohesion and Electrical Conductivity of PEDOT:PSS Conductive Polymer Films using DMSO Additives Lee, Inhwa; Kim, Gun Woo; Yang, Minyang; Kim, Taek Soo, MPC2016 Autumn Symposium, MPC, 2016-09-23 |
| Solar-Rechargeable Wearable Textile Battery Choi, Jang Wook; Lee, Yong-Hee; Kim, Joo-Seong; Noh, Jong-Hyun; Kim, Taek-Soo; Lee, Jung-Yong, 2014 Materials Research Society Spring Meeting, Materials Research Society(MRS), 2014-04-21 |
| Strain Analysis of a Single-crystalline Silicon Membrane using FEM Simulation Kim, Choelgyu; Bong, JH; Hwang, WS; Cho, Byung Jin; Kim, Taek Soo, MPC 2016 Autumn Symposium, MPC, 2016-09-23 |
| Stress and Solution Chemistry Effects for Optimized CMP of Ultra-Low-k Dielectrics Kim, Taek-Soo; Zhong, Q; Peterson, M; Tam, H; Konno, T; Dauskardt, R.H., Materials Research Society 2008 Spring Meeting, Materials Research Society, 2008-03-24 |
| Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging Kim, Taek-Soo; R.H. Dauskardt, 2009 IEEE International Reliability Physics Symposium, IEEE, 2009-04-26 |
| Tuning UV Curing Depth Profiles for Optimal Mechanical Properties of Low-k Films Kim, Taek-Soo; Chumakov, D; Zschech, E; R.H. Dauskardt, Materials Research Society 2009 Spring Meeting, Materials Research Society, 2009-04-14 |
| 고분자전해질 연료전지용 가스확산층의 소수성제 함량이 계면 접합력에 미치는 영향 김산위; 정병현; 홍보기; 김택수, 대한기계학회 신뢰성공학 부문 2015년도 춘계학술대회, 대한기계학회, 2015-02-26 |
| 다공성 유전체 기반 고감도 유연/착용형 초미세 압력센서 및 손목 맥박 감지 응용 권동욱; 이태익; 김민성; 김승환; 김택수; 박인규, 17회 한국 MEMS 학술대회, KMEMS, 2015-04-03 |
| 다중중립면을 고려한 플렉서블 디스플레이 구조의 기계적 신뢰성에 관한 연구 김완선; 이인화; 김택수, 대한기계학회 창립 70주년 기념 학술대회, 대한기계학회, 2015-11 |
| 무연솔더와 Cu 기판 계면에서 계면 반응과 금속간화합물 성장에 그래핀 전사가 미치는 영향 Ko, Yong Ho; Choi, KG; Yoon, Taeshik; Lee, CW; Kim, Taek Soo, 2016 대한용접접합학회 춘계 학술발표대회, 대한용접접합학회, 2016-04-21 |
| 소결 조건 최적화를 통한 스크린 인쇄된 전도성 나노페이스트 필름의 접합 신뢰성 향상 김재한; 김광석; 장경림; 정승부; 김택수, 한국정밀공학회 2015년 춘계학술대회, 한국정밀공학회, 2015-05-14 |
| 연료전지의 계면접합 신뢰성 향상을 위한 계면에서의 파괴에너지 측정 장경림; 김산위; 김택수, 대한기계학회 창립 70주년 기념 학술대회, 대한기계학회, 2015-11 |
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