Browse "Dept. of Mechanical Engineering(기계공학과)" by Author 1052

Showing results 1 to 3 of 3

1
Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF

Lee, Soon-Bokresearcher; Paik, Kyung-Wookresearcher; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002

2
In-situ Moire Measurement of Adhesive Flip-Chip Bonded Assembly under Thermal Cycling Condition

Ham, SJ; Kwon, WS; Paik, Kyung-Wookresearcher; Lee, Soon-Bokresearcher, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.63 - 67, IEEE, 2002-06

3
코인드 소더 범프의 수치해석

황태경; 나재웅; 백경욱researcher; 이순복researcher, 대한기계학회 학술대회, pp.0 - 0, 대한기계학회, 2002-03

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