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Prediction of crack length and crack growth rate of adhesive joints by a piezoelectric method Hwang, HY; Kim, BJ; Chin, WS; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.19, no.12, pp.1081 - 1111, 2005 |
복합재 패치 접착 수리된 알루미늄 판의 피로균열 진전거동 및 균열 감시 = Fatigue crack growth behavior and crack monitoring of cracked aluminum plate with bonded composite patch repairlink 서대철; Seo, Dae-Cheol; et al, 한국과학기술원, 2002 |
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